Key Applications
Artificial Intelligence (AI)VirtualizationHigh Performance ComputingData Analytics
Key Features
Dual Intel® Xeon® 6900-Series Processors with P-cores up to 500W with D2C liquid cooling
Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM
12 2.5″ hot-swap NVMe drive bays
2 PCIe 5.0 x16 slots (full-height, 10.5″ length)
1 AIOM/OCP 3.0 NIC slot for flexible networking options
Redundant titanium level power supplies with options from 1600W to 2600W
1U Rackmount chassis with 30.66″ (778.7mm) depth
Key Applications
Artificial Intelligence (AI)VirtualizationHigh Performance ComputingData Analytics
Key Features
Dual Intel® Xeon® 6900-Series Processors with P-cores up to 500W with D2C liquid cooling
Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM
12 2.5" hot-swap NVMe drive bays
2 PCIe 5.0 x16 slots (full-height, 10.5" length)
1 AIOM/OCP 3.0 NIC slot for flexible networking options
Redundant titanium level power supplies with options from 1600W to 2600W
1U Rackmount chassis with 30.66" (778.7mm) depth
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